Page 72 - Electronic Mechanic - TP - Volume - 2

ELECTRONICS MECHANIC - CITS

Path IC

When you check your mobile phone PCB ,you will be unable to find these ICs quickly. But when you un mount these
ICs you can easily identify that following images will be help full for understanding about its external appearance.

Majority ,Power Amp and Antenna Switch are come
as this type of IC.
MBGA(Micro Ball Grid Array)
The BGA is descended from the pin grid array
(PGA), which is a package with one face covered
(or partly covered) with pins in a grid pattern. These
pins conduct electrical signals from the integrated
circuit to the printed circuit board (PCB) onwhich it
is placed. In a BGA, the pins are replaced by balls
of solder stuck to the bottom of the package.

List of major mobile phone intergrated circuit with their functions and faults
Check following list of ICs and try to understand about that faults.
• Power Amp

• Antenna Switch
• RF Processor(hagarIC)
• Power IC
• CPU

• Charging IC
• Flash IC(ROM orEEPROM)
• Oscillator(VCO)
• Sim IC
• Key Pad IC
• LCD Light control IC

Power Amp
This is a very important IC for Transmitting signal(Tx) in your phone. This IC is work as a Tx amplifier and it get
high voltage directly from the battery. When it is damage we can see following faults.

i Signal Drop

ii No Network or Access
iii Battery low quickly
iv Can’t make a call (Tx not work properly)
v Power on failure
vi Phone will heat

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CITS : E & H - Electronics Mechanic - Exercise 134