Page 136 - CITS - Electronic Mechanic - TT - 2024

ELECTRONICS MECHANIC - CITS

Standards For ESD:
ANSI/ESD S20.20: This standard provides a comprehensive framework for establishing an Electrostatic
Discharge Control Program. It covers requirements for the design, implementation, and maintenance of ESD
control procedures in manufacturing, handling, and assembly processes.
IEC 61340 series: The International Electrotechnical Commission (IEC) 61340 series of standards provides
guidance on electrostatic control in various industries. It includes specific standards for different applications,
such as IEC 61340-5-1 for packaging materials, IEC 61340-5-2 for handling electronic components, and IEC
61340-4-6 for measuring ESD events.
ANSI/ESD STM series: These are test methods developed by the ESD Association to evaluate the effectiveness
of ESD control measures and materials. For example, ANSI/ESD STM11.11 specifies the test method for
determining the resistance of materials used in the packaging of static-sensitive devices.
MIL-STD-1686: This military standard provides guidelines for the control of electrostatic discharge in military
systems, including requirements for ESD protective packaging, grounding, and handling procedures.
Prevention and Handling Measures:
ESD Control Program: Establishing a formal ESD control program based on industry standards and guidelines is
essential. This program should include procedures for personnel training, ESD awareness, equipment grounding,
and periodic audits.

ESD Protected Area (EPA): Designate specific areas or workstations as EPAs where static-sensitive devices
are handled. These areas should be equipped with ESD control measures such as grounded work surfaces, wrist
straps, and ESD-safe packaging materials.
Personal Grounding: Workers should wear ESD wrist straps or heel straps connected to grounded surfaces to
prevent the build-up of static charges on their bodies.
Packaging and Storage: Static-sensitive devices should be stored and transported in ESD-safe packaging
materials such as conductive bags or containers. These materials dissipate static charges and protect the devices
from ESD during handling and shipping.
Equipment Grounding: Ensure that all equipment and surfaces in the EPA are properly grounded to prevent
static discharge. This includes workbenches, floors, and shelving units.

Humidity Control: Maintaining appropriate levels of humidity in the EPA can help reduce the accumulation of
static charges on surfaces and minimize the risk of ESD events.
Introduction to non soldering interconnections

Non-soldering interconnections refer to methods of joining electrical components or conductors without the use
of solder. These methods are employed in various industries, including electronics, telecommunications, and
automotive, for assembling circuits, connecting wires, and creating reliable electrical connections. Here’s an
introduction to some common non-soldering interconnection techniques:

1 Crimp Connections
Description: Crimping involves mechanically deforming a metal sleeve or terminal around a wire or conductor to
create a secure connection.

Advantages: Provides a strong and durable connection, suitable for high-vibration environments. Can be easily
inspected for quality.
Applications: Commonly used in automotive wiring harnesses, electrical appliances, and industrial equipment.

2 Wire Wrap
Description: Wire wrapping involves tightly wrapping a wire around a post or terminal on a connector or terminal
block.

Advantages: Offers excellent mechanical and electrical properties, suitable for high-frequency circuits. Allows for
easy modification and repair.
Applications: Used in telecommunications equipment, prototyping, and breadboarding.

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CITS : E & H - Electronics Mechanic - Lesson 73 - 76