Page 96 - Electronic Mechanic - TP - Volume - 2

ELECTRONICS MECHANIC - CITS

EXERCISE 140: Demonstrate De-solder and remove the
BGA IC from the PCB and clean the solder

from the bottom of the IC

Objectives

At the end of this exercise you shall be able to
• to demonstrate de-soldering BGA IC from PCB
• to demonstrate clean the solder from the bottom of the IC.

Requirements

Tools/Materials
• Trainees tools kit - 1 Set. • Cleaning solution (IPA)
• Soldering iron,25W - 1 No. • Flux - as reqd.
• De-soldering pump (plunger type) - 1 No. • Cleaning brush - 1 No.
• Heat sink plier - 1 No. • Assembled PCB board for
• Cleaning supplies - 1 No. De-soldering work - as reqd.
• De-soldering wick - as reqd.

Procedure

Theory
Here are the steps to de-solder a Ball Grid Array (BGA) IC from a PCB and clean the solder from the bottom of
the IC:

Apply Liquid Flux: Apply liquid flux on the sides of the BGA package1.
Preheat the Package: Preheat the package from both the top and bottom. Heat can be given from the bottom
using a preheater, while heat from the top can be given using a Hot Air Rework System1.

De-soldering: The most common practice to de-solder BGA is hot air1.
Cleaning the Pad: Once the BGA Package is removed, clean the pad and remove any excess solder from the
board1.

Removing Excess Solder: Use a solder sucker or de-soldering braid to remove any excess solder from bridged
joints2. Carefully reheat the joint and suck up excess material.
Please note that BGA soldering and de-soldering is different and more difficult than SMD soldering and
desoldering1. It’s important to ensure the correct process of soldering and inspection.
PCB board

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