Page 97 - Electronic Mechanic - TP - Volume - 2

ELECTRONICS MECHANIC - CITS

TASK 1: De-soldering components from PCB using de-soldering pump
1 Clean the PCB using brush; locate the component to be de-soldered from the PCB
2 Mark the component lead soldered pad/track on the solder of PCB.
3 Prepare the soldering iron for de-soldering work; touch the hot soldering iron top on the marked solder joint

4 Press the plunger, lock and hold the de-soldering pump in left hand; keep the nozzle on the de-soldering point,
hold the de-soldering pump firmly and release the button to suck the molten solder
5 Empty the de-soldering pump into

6 Repeat steps 3 to 5 on the other marked point also to de-solder the molten solder on the joint.
7 Visually inspect for leads of the component are free from the pad and pull the component from top side of PCB
using crocodile clip.
the trash so that pump is ready for next de-soldering ping.

De-soldering components using de-soldering wick
1 Follow the steps 1 to step 3 of task 1.
2 Unwind few inches of solder wick from the coil as shown in
3 Dip the end of wick into the flux and make for a clean removal
4 Place the braid over the marked soldered joint as shown in Fig 6 for de-soldering the component.

5 Place a hot soldering iron tip over the braid at the desired pin and allow the molten solder is absorbed by the
de-solder wick.
6 Remove the soldering iron and the braid quickly from the PCB; discard the used portion of the wick.

7 Observe the pad/track on the PCB and ensure the component lead is desoldered from that point.
8 Repeat the above steps for other terminals of component to be desoldered/removed.
9 Clean the PCB using IPA solution with brush. 10 Get the work checked by the Instructor.

Results: Thus, After this demonstrate we know that De-solder and remove the BGA IC from the PCB
and clean the solder from the bottom of the IC.

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CITS : E & H - Electronics Mechanic - Exercise 140